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Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method

Research article (IEEE Access, 2016) · cited 27× · AI/ML
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Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method is a scholarly article[1].

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  • Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method's instance of is recorded as scholarly article[2].

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Direct Wikidata claims

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  1. [1] ↑ . Wikidata. wikidata.org.

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APA 4ort.xyz Knowledge Graph. (2026). Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. Retrieved May 24, 2026, from https://4ort.xyz/entity/optimal-parameter-design-for-ic-wire-bonding-process-by-using-fuzzy-logic-and-taguchi-method
MLA “Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/optimal-parameter-design-for-ic-wire-bonding-process-by-using-fuzzy-logic-and-taguchi-method.
BibTeX @misc{4ortxyz_optimal-parameter-design-for-ic-wire-bonding-process-by-using-fuzzy-logic-and-taguchi-method_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method}}, year = {2026}, url = {https://4ort.xyz/entity/optimal-parameter-design-for-ic-wire-bonding-process-by-using-fuzzy-logic-and-taguchi-method}, note = {Accessed: 2026-05-24}}
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