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Optimal die placement for interposer-based 3D ICs

Research article (2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC), 2018) · cited 20× · AI/ML
academia openalex:W4246336807
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Optimal die placement for interposer-based 3D ICs

Summary

Optimal die placement for interposer-based 3D ICs is a scholarly article[1].

Key Facts

  • Optimal die placement for interposer-based 3D ICs's instance of is recorded as scholarly article[2].

References

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Direct Wikidata claims

  1. [2] ↑ . wikidata.org.

Class ancestry

  1. [1] ↑ . Wikidata. wikidata.org.

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APA 4ort.xyz Knowledge Graph. (2026). Optimal die placement for interposer-based 3D ICs. Retrieved May 24, 2026, from https://4ort.xyz/entity/optimal-die-placement-for-interposer-based-3d-ics
MLA “Optimal die placement for interposer-based 3D ICs.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/optimal-die-placement-for-interposer-based-3d-ics.
BibTeX @misc{4ortxyz_optimal-die-placement-for-interposer-based-3d-ics_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Optimal die placement for interposer-based 3D ICs}}, year = {2026}, url = {https://4ort.xyz/entity/optimal-die-placement-for-interposer-based-3d-ics}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Optimal die placement for interposer-based 3D ICs — https://4ort.xyz/entity/optimal-die-placement-for-interposer-based-3d-ics (retrieved 2026-05-24)

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