Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Research article (Journal of Electronic Packaging, 2018) · cited 25× · AI/ML
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Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

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Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips is a scholarly article[1].

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APA 4ort.xyz Knowledge Graph. (2026). Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips. Retrieved May 24, 2026, from https://4ort.xyz/entity/inverse-conduction-heat-transfer-and-kriging-interpolation-applied-to-temperature-sensor-location-in-microchips
MLA “Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/inverse-conduction-heat-transfer-and-kriging-interpolation-applied-to-temperature-sensor-location-in-microchips.
BibTeX @misc{4ortxyz_inverse-conduction-heat-transfer-and-kriging-interpolation-applied-to-temperature-sensor-location-in-microchips_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips}}, year = {2026}, url = {https://4ort.xyz/entity/inverse-conduction-heat-transfer-and-kriging-interpolation-applied-to-temperature-sensor-location-in-microchips}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips — https://4ort.xyz/entity/inverse-conduction-heat-transfer-and-kriging-interpolation-applied-to-temperature-sensor-location-in-microchips (retrieved 2026-05-24)

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