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Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach

Research article (2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022) · cited 13× · AI/ML
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Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach

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Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach is a scholarly article[1].

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APA 4ort.xyz Knowledge Graph. (2026). Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach. Retrieved May 24, 2026, from https://4ort.xyz/entity/improved-bump-detection-and-defect-identification-for-hbms-using-refined-machine-learning-approach
MLA “Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/improved-bump-detection-and-defect-identification-for-hbms-using-refined-machine-learning-approach.
BibTeX @misc{4ortxyz_improved-bump-detection-and-defect-identification-for-hbms-using-refined-machine-learning-approach_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach}}, year = {2026}, url = {https://4ort.xyz/entity/improved-bump-detection-and-defect-identification-for-hbms-using-refined-machine-learning-approach}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach — https://4ort.xyz/entity/improved-bump-detection-and-defect-identification-for-hbms-using-refined-machine-learning-approach (retrieved 2026-05-24)

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