Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm

Research article (Microelectronics Reliability, 2016) · cited 34× · AI/ML
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Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm

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Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm is a scholarly article[1].

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APA 4ort.xyz Knowledge Graph. (2026). Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. Retrieved May 24, 2026, from https://4ort.xyz/entity/defect-inspection-of-solder-bumps-using-the-scanning-acoustic-microscopy-and-fuzzy-svm-algorithm
MLA “Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/defect-inspection-of-solder-bumps-using-the-scanning-acoustic-microscopy-and-fuzzy-svm-algorithm.
BibTeX @misc{4ortxyz_defect-inspection-of-solder-bumps-using-the-scanning-acoustic-microscopy-and-fuzzy-svm-algorithm_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm}}, year = {2026}, url = {https://4ort.xyz/entity/defect-inspection-of-solder-bumps-using-the-scanning-acoustic-microscopy-and-fuzzy-svm-algorithm}, note = {Accessed: 2026-05-24}}
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