Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging

Research article (Fatigue & Fracture of Engineering Materials & Structures, 2023) · cited 19× · AI/ML
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Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging

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Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging is a scholarly article[1].

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  • Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging's instance of is recorded as scholarly article[2].

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APA 4ort.xyz Knowledge Graph. (2026). Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging. Retrieved May 24, 2026, from https://4ort.xyz/entity/deep-neural-network-aided-cohesive-zone-parameter-identifications-through-die-shear-test-in-electronic-packaging
MLA “Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/deep-neural-network-aided-cohesive-zone-parameter-identifications-through-die-shear-test-in-electronic-packaging.
BibTeX @misc{4ortxyz_deep-neural-network-aided-cohesive-zone-parameter-identifications-through-die-shear-test-in-electronic-packaging_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging}}, year = {2026}, url = {https://4ort.xyz/entity/deep-neural-network-aided-cohesive-zone-parameter-identifications-through-die-shear-test-in-electronic-packaging}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging — https://4ort.xyz/entity/deep-neural-network-aided-cohesive-zone-parameter-identifications-through-die-shear-test-in-electronic-packaging (retrieved 2026-05-24)

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