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An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Research article (IEEE Transactions on Electron Devices, 2017) · cited 20× · AI/ML
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An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

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An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem is a scholarly article[1].

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  • An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem's instance of is recorded as scholarly article[2].

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  1. [1] ↑ . Wikidata. wikidata.org.

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APA 4ort.xyz Knowledge Graph. (2026). An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem. Retrieved May 24, 2026, from https://4ort.xyz/entity/an-advanced-2-5-d-heterogeneous-integration-packaging-for-high-density-neural-sensing-microsystem
MLA “An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/an-advanced-2-5-d-heterogeneous-integration-packaging-for-high-density-neural-sensing-microsystem.
BibTeX @misc{4ortxyz_an-advanced-2-5-d-heterogeneous-integration-packaging-for-high-density-neural-sensing-microsystem_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem}}, year = {2026}, url = {https://4ort.xyz/entity/an-advanced-2-5-d-heterogeneous-integration-packaging-for-high-density-neural-sensing-microsystem}, note = {Accessed: 2026-05-24}}
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