A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology

Research article (2023 International Electron Devices Meeting (IEDM), 2023) · cited 11× · AI/ML
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A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology

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A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology is a scholarly article[1].

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  • A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology's instance of is recorded as scholarly article[2].

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APA 4ort.xyz Knowledge Graph. (2026). A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology. Retrieved May 24, 2026, from https://4ort.xyz/entity/a-0-5m-pixel-3-layer-stacked-cmos-image-sensor-with-deep-contact-and-in-pixel-cu-cu-bonding-technology
MLA “A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/a-0-5m-pixel-3-layer-stacked-cmos-image-sensor-with-deep-contact-and-in-pixel-cu-cu-bonding-technology.
BibTeX @misc{4ortxyz_a-0-5m-pixel-3-layer-stacked-cmos-image-sensor-with-deep-contact-and-in-pixel-cu-cu-bonding-technology_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology}}, year = {2026}, url = {https://4ort.xyz/entity/a-0-5m-pixel-3-layer-stacked-cmos-image-sensor-with-deep-contact-and-in-pixel-cu-cu-bonding-technology}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology — https://4ort.xyz/entity/a-0-5m-pixel-3-layer-stacked-cmos-image-sensor-with-deep-contact-and-in-pixel-cu-cu-bonding-technology (retrieved 2026-05-24)

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