3D IC Design Flow for Hybrid-bonding 3D System on Chip

3D IC Design Flow for Hybrid-bonding 3D System on Chip is a science project.

Event research_grant eu_cordis:894805

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Key Facts

Start time: April 1, 2020^[1]
End time: March 31, 2022^[2]
Participant: eu_cordis_org:999981149^[3]
Short name: H-3D-SOC^[4]
Budget: 178,320 euro^[5]
Funding scheme: Horizon 2020^[6]

📜 Data licence

© European Union, 1995-2026, CORDIS (cordis.europa.eu). Reused under Commission Decision 2011/833/EU (CC BY 4.0). Changes: selected fields restated as statements. Creative Commons Attribution 4.0 International (Commission Decision 2011/833/EU) · CORDIS — EU research results

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Quick Facts

Instance of science project

Short name H-3D-SOC

Properties

Budget 178,320 EUR

End time March 31, 2022

Funding scheme Horizon 2020

Participant INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Start time April 1, 2020

External References (3)

Cordis project id 894805

Doi 10.3030/894805

Eu rcn 228279

References

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APA

4ort.xyz Knowledge Graph. (2026). 3D IC Design Flow for Hybrid-bonding 3D System on Chip. Retrieved October 8, 2026, from https://4ort.xyz/entity/3d-ic-design-flow-for-hybrid-bonding-3d-system-on-chip

MLA

“3D IC Design Flow for Hybrid-bonding 3D System on Chip.” 4ort.xyz Knowledge Graph, 4ort.xyz, 8 Oct. 2026, https://4ort.xyz/entity/3d-ic-design-flow-for-hybrid-bonding-3d-system-on-chip.

BibTeX

@misc{4ortxyz_3d-ic-design-flow-for-hybrid-bonding-3d-system-on-chip_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{3D IC Design Flow for Hybrid-bonding 3D System on Chip}}, year = {2026}, url = {https://4ort.xyz/entity/3d-ic-design-flow-for-hybrid-bonding-3d-system-on-chip}, note = {Accessed: 2026-10-08}}

LLM prompt

According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): 3D IC Design Flow for Hybrid-bonding 3D System on Chip — https://4ort.xyz/entity/3d-ic-design-flow-for-hybrid-bonding-3d-system-on-chip (retrieved 2026-10-08)

Canonical URL: https://4ort.xyz/entity/3d-ic-design-flow-for-hybrid-bonding-3d-system-on-chip · Last refreshed: October 8, 2026