Thin small-outline package
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Thin small-outline package
Summary
Thin small-outline package ranks in the top 2% of general entities by monthly Wikipedia readership (17 views/month).[1]
Key Facts
- Thin small-outline package's image is recorded as IBM PCMCIA Data-Fax Modem V.34 FRU 42H4326 - Atmel AT29C010A-9352.jpg[2].
- Thin small-outline package's subclass of is recorded as semiconductor package[3].
- Thin small-outline package's Commons category is recorded as TSOP integrated circuit packages[4].
- Thin small-outline package's Freebase ID is recorded as /m/02p51dh[5].
- Thin small-outline package's 3D model is recorded as TSOP-I-32 18.4x8mm P0.5mm.wrl.stl[6].
- Thin small-outline package's Microsoft Academic ID is recorded as 2780016429[7].
Why It Matters
Thin small-outline package ranks in the top 2% of general entities by monthly Wikipedia readership (17 views/month).[1] It has Wikipedia articles in 8 language editions, a strong signal of global cultural recognition.[8] It is known by 5 alternative names across languages and contexts.[9]