Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

Research article (2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015) · cited 23× · AI/ML
Press Enter · cited answer in seconds

Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

Summary

Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package is a scholarly article[1].

Key Facts

  • Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package's instance of is recorded as scholarly article[2].

📑 Cite this page

Use these citations when quoting this entity in research, articles, AI prompts, or wherever provenance matters. We aggregate Wikidata + Wikipedia + authoritative open-data sources; the stitched, scored, cross-referenced view is what 4ort.xyz contributes.

APA 4ort.xyz Knowledge Graph. (2026). Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package. Retrieved May 24, 2026, from https://4ort.xyz/entity/reliability-evaluation-of-an-extreme-tsv-interposer-and-interconnects-for-the-20nm-technology-cowos-ic-package
MLA “Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/reliability-evaluation-of-an-extreme-tsv-interposer-and-interconnects-for-the-20nm-technology-cowos-ic-package.
BibTeX @misc{4ortxyz_reliability-evaluation-of-an-extreme-tsv-interposer-and-interconnects-for-the-20nm-technology-cowos-ic-package_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package}}, year = {2026}, url = {https://4ort.xyz/entity/reliability-evaluation-of-an-extreme-tsv-interposer-and-interconnects-for-the-20nm-technology-cowos-ic-package}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package — https://4ort.xyz/entity/reliability-evaluation-of-an-extreme-tsv-interposer-and-interconnects-for-the-20nm-technology-cowos-ic-package (retrieved 2026-05-24)

Canonical URL: https://4ort.xyz/entity/reliability-evaluation-of-an-extreme-tsv-interposer-and-interconnects-for-the-20nm-technology-cowos-ic-package · Last refreshed: