Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Research article (IEEE Access, 2022) · cited 26× · AI/ML
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Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

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Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach is a scholarly article[1].

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APA 4ort.xyz Knowledge Graph. (2026). Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach. Retrieved May 24, 2026, from https://4ort.xyz/entity/reliability-characterization-of-solder-joints-in-electronic-systems-through-a-neural-network-aided-approach
MLA “Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/reliability-characterization-of-solder-joints-in-electronic-systems-through-a-neural-network-aided-approach.
BibTeX @misc{4ortxyz_reliability-characterization-of-solder-joints-in-electronic-systems-through-a-neural-network-aided-approach_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach}}, year = {2026}, url = {https://4ort.xyz/entity/reliability-characterization-of-solder-joints-in-electronic-systems-through-a-neural-network-aided-approach}, note = {Accessed: 2026-05-24}}
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