Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band

Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2017) · cited 10× · AI/ML
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Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band

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Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band is a scholarly article[1].

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  • Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band's instance of is recorded as scholarly article[2].

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APA 4ort.xyz Knowledge Graph. (2026). Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band. Retrieved May 24, 2026, from https://4ort.xyz/entity/packaging-of-high-gain-multichip-module-in-multilayer-lcp-substrates-at-w-band
MLA “Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/packaging-of-high-gain-multichip-module-in-multilayer-lcp-substrates-at-w-band.
BibTeX @misc{4ortxyz_packaging-of-high-gain-multichip-module-in-multilayer-lcp-substrates-at-w-band_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band}}, year = {2026}, url = {https://4ort.xyz/entity/packaging-of-high-gain-multichip-module-in-multilayer-lcp-substrates-at-w-band}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band — https://4ort.xyz/entity/packaging-of-high-gain-multichip-module-in-multilayer-lcp-substrates-at-w-band (retrieved 2026-05-24)

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