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Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Research article (2016 International Conference on Electronics Packaging (ICEP), 2016) · cited 23× · AI/ML
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Summary
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis is a scholarly article[1].
Key Facts
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis's instance of is recorded as scholarly article[2].
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APA4ort.xyz Knowledge Graph. (2026). Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis. Retrieved May 24, 2026, from https://4ort.xyz/entity/novel-processing-scheme-for-embedding-and-interconnection-of-ultra-thin-ic-devices-in-flexible-chip-foil-packages-and-re
MLA“Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/novel-processing-scheme-for-embedding-and-interconnection-of-ultra-thin-ic-devices-in-flexible-chip-foil-packages-and-re.
BibTeX@misc{4ortxyz_novel-processing-scheme-for-embedding-and-interconnection-of-ultra-thin-ic-devices-in-flexible-chip-foil-packages-and-re_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis}}, year = {2026}, url = {https://4ort.xyz/entity/novel-processing-scheme-for-embedding-and-interconnection-of-ultra-thin-ic-devices-in-flexible-chip-foil-packages-and-re}, note = {Accessed: 2026-05-24}}
LLM promptAccording to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis — https://4ort.xyz/entity/novel-processing-scheme-for-embedding-and-interconnection-of-ultra-thin-ic-devices-in-flexible-chip-foil-packages-and-re (retrieved 2026-05-24)
