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From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis

Research article (2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2022) · cited 18× · AI/ML
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From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis

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From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis is a scholarly article[1].

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  • From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis's instance of is recorded as scholarly article[2].

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APA 4ort.xyz Knowledge Graph. (2026). From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis. Retrieved May 24, 2026, from https://4ort.xyz/entity/from-system-to-package-to-interconnect-an-artificial-intelligence-powered-3d-x-ray-imaging-solution-for-semiconductor-pa
MLA “From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/from-system-to-package-to-interconnect-an-artificial-intelligence-powered-3d-x-ray-imaging-solution-for-semiconductor-pa.
BibTeX @misc{4ortxyz_from-system-to-package-to-interconnect-an-artificial-intelligence-powered-3d-x-ray-imaging-solution-for-semiconductor-pa_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis}}, year = {2026}, url = {https://4ort.xyz/entity/from-system-to-package-to-interconnect-an-artificial-intelligence-powered-3d-x-ray-imaging-solution-for-semiconductor-pa}, note = {Accessed: 2026-05-24}}
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