Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias

Research article (2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS), 2016) · cited 13× · AI/ML
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Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias

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Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias is a scholarly article[1].

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APA 4ort.xyz Knowledge Graph. (2026). Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias. Retrieved May 24, 2026, from https://4ort.xyz/entity/electrical-modeling-and-analysis-of-3d-neuromorphic-ic-with-monolithic-inter-tier-vias
MLA “Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/electrical-modeling-and-analysis-of-3d-neuromorphic-ic-with-monolithic-inter-tier-vias.
BibTeX @misc{4ortxyz_electrical-modeling-and-analysis-of-3d-neuromorphic-ic-with-monolithic-inter-tier-vias_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias}}, year = {2026}, url = {https://4ort.xyz/entity/electrical-modeling-and-analysis-of-3d-neuromorphic-ic-with-monolithic-inter-tier-vias}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias — https://4ort.xyz/entity/electrical-modeling-and-analysis-of-3d-neuromorphic-ic-with-monolithic-inter-tier-vias (retrieved 2026-05-24)

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