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Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network

Research article (2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2020) · cited 18× · AI/ML
academia openalex:W3083743696
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Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network

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Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network is a scholarly article[1].

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APA 4ort.xyz Knowledge Graph. (2026). Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network. Retrieved May 24, 2026, from https://4ort.xyz/entity/double-feature-extraction-method-for-wafer-map-classification-based-on-convolution-neural-network
MLA “Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/double-feature-extraction-method-for-wafer-map-classification-based-on-convolution-neural-network.
BibTeX @misc{4ortxyz_double-feature-extraction-method-for-wafer-map-classification-based-on-convolution-neural-network_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network}}, year = {2026}, url = {https://4ort.xyz/entity/double-feature-extraction-method-for-wafer-map-classification-based-on-convolution-neural-network}, note = {Accessed: 2026-05-24}}
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