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Bottom-up Cu filling of annular through silicon vias: Microstructure and texture

Research article (Electrochimica Acta, 2020) · cited 32× · AI/ML
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Bottom-up Cu filling of annular through silicon vias: Microstructure and texture

Summary

Bottom-up Cu filling of annular through silicon vias: Microstructure and texture is a scholarly article[1].

Key Facts

  • Bottom-up Cu filling of annular through silicon vias: Microstructure and texture's instance of is recorded as scholarly article[2].

References

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Direct Wikidata claims

  1. [2] ↑ . wikidata.org.

Class ancestry

  1. [1] ↑ . Wikidata. wikidata.org.

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APA 4ort.xyz Knowledge Graph. (2026). Bottom-up Cu filling of annular through silicon vias: Microstructure and texture. Retrieved May 24, 2026, from https://4ort.xyz/entity/bottom-up-cu-filling-of-annular-through-silicon-vias-microstructure-and-texture
MLA “Bottom-up Cu filling of annular through silicon vias: Microstructure and texture.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/bottom-up-cu-filling-of-annular-through-silicon-vias-microstructure-and-texture.
BibTeX @misc{4ortxyz_bottom-up-cu-filling-of-annular-through-silicon-vias-microstructure-and-texture_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Bottom-up Cu filling of annular through silicon vias: Microstructure and texture}}, year = {2026}, url = {https://4ort.xyz/entity/bottom-up-cu-filling-of-annular-through-silicon-vias-microstructure-and-texture}, note = {Accessed: 2026-05-24}}
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