Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures

Research article (Journal of Materials Science Materials in Electronics, 2019) · cited 16× · AI/ML
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Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures

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Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures is a scholarly article[1].

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  • Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures's instance of is recorded as scholarly article[2].

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APA 4ort.xyz Knowledge Graph. (2026). Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures. Retrieved May 24, 2026, from https://4ort.xyz/entity/bonding-performance-of-sintered-nanosilver-joints-on-bare-copper-substrates-with-different-grain-structures
MLA “Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/bonding-performance-of-sintered-nanosilver-joints-on-bare-copper-substrates-with-different-grain-structures.
BibTeX @misc{4ortxyz_bonding-performance-of-sintered-nanosilver-joints-on-bare-copper-substrates-with-different-grain-structures_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures}}, year = {2026}, url = {https://4ort.xyz/entity/bonding-performance-of-sintered-nanosilver-joints-on-bare-copper-substrates-with-different-grain-structures}, note = {Accessed: 2026-05-24}}
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