Integrated_Circuit_Model
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488
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69
Websites Tracked
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Snapdragon 720G
class
system on a chip
Xiaomi Xring O1
Place
system-on-a-chip model developed by Xiaomi
Intel Core i7-6800X
Place
AMD Ryzen 7 Pro 1700X
Place
Intel Core i7-960
Place
Intel Core i7-6700
Place
Intel desktop CPU
DRV8825
Place
stepper motor driver by Texas Instrument
AMD Ryzen 5 3500X
class
microprocessor model released in 2019
AMD Ryzen 7 5800U
Place
microprocessor
Intel Core m3-7Y30
Place
Weitek SPARC POWER μP WTL 8601
class
central processing unit by Weitek
Alpha 21066 chip
class
Snapdragon 778G+ 5G
Place
system-on-a-chip for mobile devices
Intel Core i7-860
Place
Snapdragon 400
Place
Family of systems-on-a-chip developed by Qualcomm in 2013 for primary use in mobile phones and table
Intel Xeon W-2245
Place
Xbox One S APU
Place
main system-on-a-chip of the Xbox One, containing the CPU and GPU
Intel Xeon Phi 7285
Place
central processing unit
AMD Ryzen 7 3700X
Place
desktop microprocessor model
Intel Core i5-6440HQ
Place
Snapdragon 200
Place
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Intel Core i7-7700K
Place
central processing unit
Adreno 305
Place
MT7976C
class
integrated circuit from MediaTek
Core 2 Quad Q9650
Place
Intel's Central processing unit
AMD Ryzen Threadripper 2950X
Place
central processing unit
Intel Core i7-3770
Place
central processing unit
AMD Ryzen 5 Pro 3600
class
microprocessor model released in 2019
MediaTek MT6739
class
system-on-a-chip for smartphones etc.
MediaTek MT6572W
class
system-on-a-chip by MediaTek
Xeon Gold 6233
class
Intel Core i7-1360P
Place
AMD Ryzen 5 1500X
Place
central processing unit
Intel Xeon X5670
Place
CPU model
μPD78214GC
class
processor
NEC V30 MZ
class
low power version of the NEC V30
PowerVR GE8100
class
graphics processor core model
Intel Core i7-1185G7
Place
AMD EPYC 7542
Place
processor model
M58821P
class
Nintendo Color TV Game Block Breaker CPU
Snapdragon 800
Place
Intel Core i7-610E
Place
Snapdragon S2
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Intel Core i5-4200U
Place
Intel processor
BCM5352
class
router system-on-chip (SoC)
Cypress CY7C601
class
central processing unit by Cypress
Marvell PXA1908
class
low-end ARM64 SoC released in late 2014
Intel Core i5-3330
Place
Desktop processor Intel Core i5-3330
Intel Core i7-965 Extreme Edition
Place
Intel Core i7-940
Place
GP104
Place
2016 graphics processing unit manufactured by Nvidia
AMD Ryzen 3 2300X
class
microprocessor model released in 2018
AMD Ryzen 5 2500U
class
AMD 2nd-generation Ryzen mobile processor
ESP32-C61
class
RISC-V based Espressif microcontroller SoC with WiFi 6 and Bluetooth BLE 5.0
AMD Ryzen 7 1700
Place
central processing unit
Intel Core i7-8700K
Place
Intel Xeon 6152
Place
CPU model
Intel Core i7-1165G7
Place
Snapdragon S4
Place
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Intel Core i7-7800X
Place