Electronic_Component

Snapdragon 778G+ 5G

Place

system-on-a-chip for mobile devices

Xbox One APU

Place

main system-on-a-chip of the Xbox One, containing the CPU and GPU

Input capture

Product

AMD Versal

class

AMD Ryzen Threadripper 2950X

Place

central processing unit

Broadcom BCM2711

Product

ARM system-on-a-chip by Broadcom released in 2020

Intel Core i7-4770HQ

Product

central processing unit

WRX80

Product

motherboard chipset for socket sWRX8 and AMD Ryzen Threadripper PRO processors

ATECC

Product

CryptoAuthentication chips from Atmel

MediaTek MT6750N

class

system-on-a-chip by MediaTek, apparently a version of MT6750 with a higher clocked GPU

Imagination BXT GPU

Product

GPU designed by Imagination

MT6630

Product

Jamdac

Product

virtual sound chip for the Hybrix platform

AMD Barcelo

Product

gpu from the GCN 5.1 microarchitecture

AMD EPYC Zen 2

class

Zen 2 family of 64-bit microprocessors for servers and workstations

AMD Ryzen Threadripper 1950X

Place

central processing unit

ARM Mali-T720 MP2

Product

Spreadtrum SC7727S

Place

IBM Nighthawk

Product

Quantum processor from IBM with “error mitigation”, 5000 gates and 120 qubits

AMD Ryzen Threadripper 2920X

Place

central processing unit

Exynos 4412

Place

system-on-a-chip processor for smartphones etc.

Intel B760

Product

Intel chipset

AMD Ryzen Threadripper 1920X

Place

central processing unit

SMSC KBC1126

Product

Embedded controller

AMD Cezanne

Product

gpu from the GCN 5.1 microarchitecture

Atheros AR9001U-2NG

Product

Allwinner H3

Product

Allwinner H3 (sun8iw7p1) SOC 4K OTT Box Total Solution

AMD Ryzen Threadripper 2990WX

Place

central processing unit

Renesas H8S/2161BV

Product

AMD Mendocino

Product

gpu from the RDNA 2 microarchitecture

3DLabs P20

Product

Successor of the graphics processor 3Dlabs P10

Google Ironwood

Product

Tensor processing unit by Google

Snapdragon S3

class

system-on-a-chip developed by Qualcomm for primary use in mobile phones

Votrax SC-01

Thing

speech synthesis IC

Mediatek Dimensity 6100+

Product

smartphone SoC

Marvell PXA1088

class

GR712RC

Product

system on a chip processor for the space industry

Cx4

Product

math coprocessor

AMD Raven

Product

gpu from the GCN 5.0 microarchitecture

NVIDIA GB10 Grace Blackwell Superchip

Product

complex circuit system optimized for AI calculations

APL2298

class

Apple SoC in iPod Touch (3rd Generation)

DJI Mic

Place

Mic pack by DJI

core complex die

Product

a chiplet component of AMD Zen processors

Atheros AR9344

Product

AMD EPYC Zen

class

Zen family of 64-bit microprocessors for servers and workstations

OMAP 3430

Product

Intel HD Graphics 4000

Product

integrated graphics processor by Intel

Azul Vega 1

Product

CPU

Intel 82801AA AC97 Audio

Product

sound card

Snapdragon 810

Place

system-on-a-chip developed by Qualcomm for primary use in mobile phones

Tensilica Xtensa LX6

class

microprocessor core

AMD Renoir

Product

gpu from the GCN 5.1 microarchitecture

Cortical Processor

Product

hardware implementation of the hierarchical temporal memory

Zalman ZM-MIC 1

Place

lavalier microphone

Hexagon 680

Product

digital signal processor developed by Qualcomm

MediaTek MT6572W

class

system-on-a-chip by MediaTek

CM–15

Place

large-diaphragm condenser microphone by Teenage Engineering

AMD Ryzen Threadripper 2970WX

Place

central processing unit

IBM Starling

Product

IBM quantum processor planned for 2029 (100 million gates, 200 logical qubits)

Apple A18 Pro

Product

system on a chip (SoC) designed by Apple Inc