Electrical Element
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Integrated Circuit Series (178)
Microprocessor (80)
Microcontroller (75)
Chipset (39)
System On A Chip (33)
Integrated Circuit (32)
System On A Chip Model (31)
Electronic Component (28)
Processor (26)
Cpu Socket (14)
Embedded Controller (8)
Model Series (7)
Floating-Point Unit (6)
Field-Programmable Gate Array (5)
Sound Chip (5)
Microprocessor (80)
Microcontroller (75)
Chipset (39)
System On A Chip (33)
Integrated Circuit (32)
System On A Chip Model (31)
Electronic Component (28)
Processor (26)
Cpu Socket (14)
Embedded Controller (8)
Model Series (7)
Floating-Point Unit (6)
Field-Programmable Gate Array (5)
Sound Chip (5)
Snapdragon 400
Place
Family of systems-on-a-chip developed by Qualcomm in 2013 for primary use in mobile phones and tablets
cIOD
Product
a chiplet component of consumer AMD Zen processors
VFPv2
Product
Floating point coprocessor
Snapdragon 778G+ 5G
Place
system-on-a-chip for mobile devices
Exynos 4412
Place
system-on-a-chip processor for smartphones etc.
BCM5976TC1KUB60G
Product
Broadcom touch controller
Exynos 980
class
Exynos 4210
Place
system-on-a-chip processor for smartphones etc.
Allwinner H3
Product
Allwinner H3 (sun8iw7p1) SOC 4K OTT Box Total Solution
Spreadtrum SC7727S
Place
Semtech SX1302
Product
Snapdragon 410
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Azul Vega 3
Product
CPU
SNMC FDC37N958FR
Product
Embedded controller
Snapdragon 662
Place
system-on-a-chip developed by Qualcomm
ENE KB3700
Product
Embedded controller
Ridge Summit
Product
AMD microarchitecture
Snapdragon 480 Plus 5G
class
system-on-a-chip for smartphones developed by Qualcomm
Goonhilly Antenna No. 2
Product
decommissioned antenna at Goonhilly Satellite Earth Station
Intel Z390
Product
Chipset from Intel for socket 1151
MediaTek MT6739
class
system-on-a-chip for smartphones etc.
S-DD1
Product
Nintendo ASIC for SNES cartridges
Input capture
Product
Tensilica Xtensa LX6
class
microprocessor core
AMD TRX50
Product
Chipset on motherboards for AMD processors
MEC1308
Product
Embedded controller
Snapdragon 600
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Apple A18 Pro
Product
system on a chip (SoC) designed by Apple Inc
LANDRS Science Drone Hex1
Place
First iteration of the LANDRS Hexacopter Science Drone
Marvell PXA1908
class
low-end ARM64 SoC released in late 2014
MT6630
Product
Unicore
Product
Type of toroidal transformer
Marvell PXA1088
class
Intel Core i7-4770HQ
Product
central processing unit
Atmel ATSAMD21G18 MCU
Product
Atheros AR9331
Product
Wi-Fi System-On-Chip
Hi3798Mv200
Product
SoC produced by Hisilicon used in 4K TV boxes
core complex die
Product
a chiplet component of AMD Zen processors
Mediatek MT6229
Product
Snapdragon 810
Place
system-on-a-chip developed by Qualcomm for primary use in mobile phones
SMSC KBC1126
Product
Embedded controller
NEC μPD7901G
Product
System-on-a-chip introduced by NEC in 1981
IBM Nighthawk
Product
Quantum processor from IBM with “error mitigation”, 5000 gates and 120 qubits
MEC1322
Product
Embedded controller
Xiaomi Xring O1
Place
system-on-a-chip model developed by Xiaomi
HI3798C V200
Product
SoC produced by Hisilicon used in 4K TV boxes
MediaTek Dimensity 700
class
5G-capable system-on-a-chip by MediaTek for smartphones
Snapdragon S4
Place
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Intel AnyWAN GRX350
Product
processor
Snapdragon 805
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Google Ironwood
Product
Tensor processing unit by Google
I.MX UART
Product
UART module integrated in I.MX SOCs
Snapdragon 200
Place
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Freescale P5020
Product
ARM Mali-T830
Product
STM32L151UCY6
Product
ST Microelectronics Ultra-low-power MCU
Semtech SX1303
Product
Snapdragon S3
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
MEAS MS5611
Thing
Barometric Pressure Sensors
Xbox One APU
Place
main system-on-a-chip of the Xbox One, containing the CPU and GPU