Designation

GP104

Place

2016 graphics processing unit manufactured by Nvidia

Snapdragon 200

Place

system-on-a-chip developed by Qualcomm for primary use in mobile phones

AMD Ryzen Threadripper 1920X

Place

central processing unit

Snapdragon 810

Place

system-on-a-chip developed by Qualcomm for primary use in mobile phones

Adreno 205

Place

M58821P

class

Nintendo Color TV Game Block Breaker CPU

Intel Xeon Phi 7285

Place

central processing unit

Intel Xeon Phi 7250

class

processor model released by Intel

AMD Ryzen Threadripper 3990X

class

x86-64 microprocessors by Advanced Micro Devices

Intel Core i7-3770

Place

central processing unit

AMD Athlon 64 X2 4200+

Product

a dual-core CPU (id: ada4200iaa5cu)

Intel Core i7-1360P

Place

BCM5352

class

router system-on-chip (SoC)

MediaTek MT6739

class

system-on-a-chip for smartphones etc.

Mediatek MT6737

Product

Intel Core i7-7700K

Place

central processing unit

Adreno 305

Place

Cypress CY7C601

class

central processing unit by Cypress

Intel Core i5-6440HQ

Place

Marvell PXA1908

class

low-end ARM64 SoC released in late 2014

Snapdragon 400

Place

Family of systems-on-a-chip developed by Qualcomm in 2013 for primary use in mobile phones and table

Xeon Gold 6148

Place

CPU model

AMD Ryzen 7 3700X

Place

desktop microprocessor model

Intel Processor

Place

brand of Intel microprocessors, replacing the Celeron and Pentium branding

Snapdragon 808

class

system-on-a-chip developed by Qualcomm for primary use in mobile phones

Snapdragon 778G+ 5G

Place

system-on-a-chip for mobile devices

Weitek SPARC POWER μP WTL 8601

class

central processing unit by Weitek

AMD Ryzen 7 2700

class

microprocessor model released in 2018

AMD Ryzen Threadripper 2950X

Place

central processing unit

Intel Core i9-9900K

Place

eight-core CPU with 16 threads from Intel

Xeon Platinum 8368Q 38C

class

Snapdragon 662

Place

system-on-a-chip developed by Qualcomm

AMD Ryzen 7 5800U

Place

microprocessor

Intel Core i7-975 Extreme Edition

Place

Snapdragon S2

class

system-on-a-chip developed by Qualcomm for primary use in mobile phones

Intel Xeon 6152

Place

CPU model

Intel Core i7-4771

Place

Intel Core i7-7700T

Place

central processing unit

Intel Core i7-870S

Place

Exynos 4210

Place

system-on-a-chip processor for smartphones etc.

Intel Core i7-960

Place

Intel Core i7-6800X

Place

AMD Ryzen Threadripper 1950X

Place

central processing unit

Spreadtrum SC7727S

Place

AMD Ryzen Threadripper 2920X

Place

central processing unit

PlayStation 4 APU

class

main system-on-a-chip of the PlayStation 4, containing the CPU and GPU

Xeon Platinum 8358 32C

Place

CPU

Rob Halförd

Person

Pseudonymous founder of Gridcoin, the name comes from the singer.

AMD Ryzen 3 1200 AF

class

microprocessor model released in 2020

MM-57186N

class

National Semiconductor chip with 6 pong games: Wipe-Out(breakout), Flipper, Tennis, Handball, Hockey

PlayStation 4 Pro APU

class

main system-on-a-chip of the PlayStation 4 Pro, containing the CPU and GPU

Intel Xeon Phi 7295

Place

central processing unit

Snapdragon S3

class

system-on-a-chip developed by Qualcomm for primary use in mobile phones

Intel Core i5-14600K

Place

mid-range Intel processor released in 2023

Intel Core i7-860

Place

Core 2 Quad Q9650

Place

Intel's Central processing unit

AMD Ryzen 5 2500X

class

microprocessor model released in 2018

Vivante GC7000UL

class

AMD Ryzen 5 1400

Place

central processing unit

Intel Xeon W-2145

Place