# wafer dicing

> the process by which die are separated from a wafer of semiconductor following the processing of the wafer

**Wikidata**: [Q4388382](https://www.wikidata.org/wiki/Q4388382)  
**Wikipedia**: [English](https://en.wikipedia.org/wiki/Die_singulation)  
**Source**: https://4ort.xyz/entity/wafer-dicing


## References

1. [OpenAlex](https://docs.openalex.org/download-snapshot/snapshot-data-format)