# Using ultra-low parasitic hybrid packaging method to reduce high frequency EMI noise for SiC power module

> Research article (2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2017) · cited 13× · AI/ML

**Wikidata**: [openalex:W2775449369](https://www.wikidata.org/wiki/openalex:W2775449369)  
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