# three-dimensional integrated circuit

> integrated circuit with vertical interconnections

**Wikidata**: [Q229370](https://www.wikidata.org/wiki/Q229370)  
**Wikipedia**: [English](https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit)  
**Source**: https://4ort.xyz/entity/three-dimensional-integrated-circuit

## Summary
A three-dimensional integrated circuit is an integrated circuit with vertical interconnections that allows multiple layers of electronic circuits to be stacked on top of each other rather than being confined to a single flat plane. This technology enables higher performance, greater functionality, and reduced power consumption in a smaller footprint compared to traditional integrated circuits.

## Key Facts
- A three-dimensional integrated circuit (3D IC) is defined as an integrated circuit with vertical interconnections
- It is a subclass of integrated circuit, which is an electronic circuit formed on a small, flat piece of semiconductor material
- It has "layer" as one of its component parts
- It is used in multi-channel DRAM, which is employed in the Intel Xeon Phi processor codenamed Knights Landing
- It has 9 sitelinks across different language versions of Wikipedia
- Information about 3D ICs is available in 9 languages: Arabic, Catalan, German, English, Spanish, Estonian, Korean, Portuguese, and Chinese
- Its freebase ID is /m/03m6bzn
- Its Microsoft Academic ID (discontinued) is 59088047

## FAQs
### Q: What is the difference between a 3D IC and a traditional integrated circuit?
A: A three-dimensional integrated circuit has vertical interconnections allowing multiple layers of electronic circuits to be stacked, while traditional integrated circuits are confined to a single flat plane of semiconductor material.

### Q: Where are three-dimensional integrated circuits used?
A: They are used in multi-channel DRAM, which is employed in the Intel Xeon Phi processor codenamed Knights Landing.

### Q: How does a three-dimensional integrated circuit improve upon traditional designs?
A: By stacking multiple layers vertically, 3D ICs can achieve higher performance, reduced power consumption, and greater functionality in a smaller footprint compared to traditional flat integrated circuits.

## Why It Matters
Three-dimensional integrated circuits represent a significant advancement in semiconductor technology by moving beyond the traditional two-dimensional limitations of integrated circuits. By stacking multiple layers of electronic circuits with vertical interconnections, 3D ICs enable higher performance, greater functionality, and reduced power consumption in a smaller physical footprint. This technology is particularly important for applications where space is limited, such as in mobile devices and high-performance computing systems. As electronic devices continue to demand more processing power in increasingly compact forms, three-dimensional integrated circuits play a crucial role in meeting these requirements without the limitations of traditional flat designs.

## Notable For
- Vertical interconnections that allow stacking of multiple circuit layers
- Use in multi-channel DRAM for the Intel Xeon Phi processor codenamed Knights Landing
- Available in 9 different language versions on Wikipedia, indicating global relevance
- Recognition as a distinct subclass of integrated circuits with unique structural advantages

## Body
### Definition and Structure
A three-dimensional integrated circuit (3D IC) is an electronic circuit formed on multiple layers of semiconductor material with vertical interconnections connecting these layers. Unlike traditional integrated circuits that are confined to a single flat plane, 3D ICs stack multiple layers vertically, allowing for greater functionality in a smaller footprint.

### Components
- Layer: A fundamental component of three-dimensional integrated circuits
- Vertical interconnections: The key feature that enables communication between stacked layers

### Applications
- Multi-channel DRAM: A 3D-stacked DRAM implementation used in the Intel Xeon Phi processor codenamed Knights Landing

### Classification
- Subclass of: integrated circuit
- Class: electronic circuit formed on a small, flat piece of semiconductor material (though 3D ICs extend beyond this flat limitation)

### Availability
- Wikipedia available in 9 languages: Arabic, Catalan, German, English, Spanish, Estonian, Korean, Portuguese, and Chinese
- 9 sitelinks across different language versions
- Freebase ID: /m/03m6bzn
- Microsoft Academic ID (discontinued): 59088047

### Alternative Names
- 3D IC
- Three dimensional integrated circuit
- 3Dダイスタッキング (Japanese)
- 3Dチップ (Japanese)
- 立体集積回路 (Japanese)

## References

1. [OpenAlex](https://docs.openalex.org/download-snapshot/snapshot-data-format)