# Thermal Analysis and Interpolation Techniques for a Logic + WideIO Stacked DRAM Test Chip

> Research article (IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2015) · cited 24× · AI/ML

**Wikidata**: [openalex:W2308963902](https://www.wikidata.org/wiki/openalex:W2308963902)  
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