# Temporary Bonding and Debonding Technologies for Fan-Out Wafer-Level Packaging

> Research article (2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017) · cited 17× · AI/ML

**Wikidata**: [openalex:W2742828784](https://www.wikidata.org/wiki/openalex:W2742828784)  
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