# SRP-PINN: A Physics-Informed Neural Network Model for Simulating Thermal Profile of Soldering Reflow Process

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2024) · cited 14× · AI/ML

**Wikidata**: [openalex:W4396766955](https://www.wikidata.org/wiki/openalex:W4396766955)  
**Source**: https://4ort.xyz/entity/srp-pinn-a-physics-informed-neural-network-model-for-simulating-thermal-profile-of-soldering-reflow-process