# Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

> Research article (2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015) · cited 23× · AI/ML

**Wikidata**: [openalex:W1586372630](https://www.wikidata.org/wiki/openalex:W1586372630)  
**Source**: https://4ort.xyz/entity/reliability-evaluation-of-an-extreme-tsv-interposer-and-interconnects-for-the-20nm-technology-cowos-ic-package