# Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks

> Research article (Microelectronics Reliability, 2022) · cited 12× · AI/ML

**Wikidata**: [openalex:W4206599222](https://www.wikidata.org/wiki/openalex:W4206599222)  
**Source**: https://4ort.xyz/entity/reliability-analysis-and-condition-monitoring-of-sac-solder-joints-under-high-thermomechanical-stress-conditions-using-n