# Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

> Research article (Journal of Materials Science Materials in Electronics, 2016) · cited 49× · AI/ML

**Wikidata**: [openalex:W2478850024](https://www.wikidata.org/wiki/openalex:W2478850024)  
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