# Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network

> Research article (Applied Sciences, 2022) · cited 16× · AI/ML

**Wikidata**: [openalex:W4308972088](https://www.wikidata.org/wiki/openalex:W4308972088)  
**Source**: https://4ort.xyz/entity/predicting-the-wafer-material-removal-rate-for-semiconductor-chemical-mechanical-polishing-using-a-fusion-network