# Physics-based Nested-ANN Approach for Fan-Out Wafer-Level Package Reliability Prediction

> Research article (2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022) · cited 15× · AI/ML

**Wikidata**: [openalex:W4285047937](https://www.wikidata.org/wiki/openalex:W4285047937)  
**Source**: https://4ort.xyz/entity/physics-based-nested-ann-approach-for-fan-out-wafer-level-package-reliability-prediction