# Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2017) · cited 10× · AI/ML

**Wikidata**: [openalex:W2749585003](https://www.wikidata.org/wiki/openalex:W2749585003)  
**Source**: https://4ort.xyz/entity/packaging-of-high-gain-multichip-module-in-multilayer-lcp-substrates-at-w-band