# Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

> Research article (Journal of Materials Science, 2023) · cited 11× · AI/ML

**Wikidata**: [openalex:W4322492880](https://www.wikidata.org/wiki/openalex:W4322492880)  
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