# Optimal die placement for interposer-based 3D ICs

> Research article (2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC), 2018) · cited 20× · AI/ML

**Wikidata**: [openalex:W4246336807](https://www.wikidata.org/wiki/openalex:W4246336807)  
**Source**: https://4ort.xyz/entity/optimal-die-placement-for-interposer-based-3d-ics