# Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis

> Research article (2016 International Conference on Electronics Packaging (ICEP), 2016) · cited 23× · AI/ML

**Wikidata**: [openalex:W2412928147](https://www.wikidata.org/wiki/openalex:W2412928147)  
**Source**: https://4ort.xyz/entity/novel-processing-scheme-for-embedding-and-interconnection-of-ultra-thin-ic-devices-in-flexible-chip-foil-packages-and-re