# multi-chip module

> discrete electronic assembly containing multiple integrated circuits that behaves as a unit

**Wikidata**: [Q1466268](https://www.wikidata.org/wiki/Q1466268)  
**Wikipedia**: [English](https://en.wikipedia.org/wiki/Multi-chip_module)  
**Source**: https://4ort.xyz/entity/multi-chip-module

## Summary
A multi-chip module (MCM) is a discrete electronic assembly containing multiple integrated circuits that functions as a single unit, combining different semiconductor devices and passive components on a substrate.

## Key Facts
- Defined as a discrete electronic assembly containing multiple integrated circuits that behaves as a unit
- Classifies as a hybrid integrated circuit and an electronic component
- Related to system in package (SiP) and package on a package (PoP) technologies
- Consists of parts including chiplets, printed circuit boards, and passive electronic components
- Uses advanced packaging as its fabrication method
- Subclass of hybrid integrated circuit, semiconductor package, and component
- Has aliases including MCM, multichip module, and Multi-Chip Module
- Has sitelink_count of 12
- Wikipedia title is "Multi-chip module"
- Commons category is "Multi-chip modules"

### Q: What is the difference between a multi-chip module and a system in package?
A: While both are integrated circuit packaging types, a multi-chip module contains multiple integrated circuits enclosed in a single module, whereas a system in package groups a number of integrated circuits in a single module.

### Q: What are the components typically found in a multi-chip module?
A: Multi-chip modules typically contain chiplets, printed circuit boards (often), and passive electronic components.

### Q: How does a multi-chip module differ from a traditional integrated circuit?
A: Unlike traditional monolithic integrated circuits that combine all components on a single chip, a multi-chip module combines multiple integrated circuits on a common substrate, functioning as a single unit.

## Why It Matters
Multi-chip modules represent a significant advancement in electronic packaging technology, enabling the integration of multiple integrated circuits into a single package. This approach addresses the limitations of traditional monolithic integrated circuits by allowing designers to combine different types of chips and components on a common substrate. The technology has been crucial for high-performance computing applications, particularly in supercomputers and high-end processors, where performance and power efficiency are critical. By enabling better thermal management and reduced interconnect distances, MCMs have contributed to the development of more powerful and efficient electronic systems.

## Notable For
- First used in Soviet ECL modules for the Elbrus-2 supercomputer
- Implemented in AMD Ryzen 5 3600 microprocessor
- Used in 416 series integrated circuits for Soviet television
- Utilizes advanced packaging techniques
- Functions as a discrete unit containing multiple integrated circuits

## Body
### Definition and Classification
A multi-chip module (MCM) is a discrete electronic assembly containing multiple integrated circuits that behaves as a unit. It falls under the classification of hybrid integrated circuits and electronic components. The technology is considered an integrated circuit packaging type and is subclassified as a semiconductor package.

### Components and Structure
Multi-chip modules typically consist of several key components:
- **Chiplets**: Multiple integrated circuits that are integrated together
- **Printed circuit boards**: Often used as part of the assembly
- **Passive electronic components**: Often included in the module

The assembly is fabricated using advanced packaging techniques, which allow multiple components to be integrated on a common substrate.

### Historical Applications
Multi-chip modules have been used in various applications:
- **Soviet ECL modules**: The 200 series integrated circuits were used in Elbrus-2 supercomputer
- **Soviet television**: The 416 series integrated circuits were used in television equipment
- **Modern processors**: Implemented in AMD Ryzen 5 3600 microprocessor

These applications demonstrate the versatility and historical significance of multi-chip module technology across different computing platforms and eras.

### Technical Characteristics
The technology combines different semiconductor devices and passive components on a substrate, creating a miniaturized electronic circuit. This approach allows for better performance and efficiency compared to traditional integrated circuits by enabling optimized component placement and reduced interconnect distances.

## References

1. [Source](https://github.com/JohnMarkOckerbloom/ftl/blob/master/data/wikimap)
2. Freebase Data Dumps. 2013
3. National Library of Israel Names and Subjects Authority File