# Machine-Learning Approach in Detection and Classification for Defects in TSV-Based 3-D IC

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2018) · cited 54× · AI/ML

**Wikidata**: [openalex:W2790997597](https://www.wikidata.org/wiki/openalex:W2790997597)  
**Source**: https://4ort.xyz/entity/machine-learning-approach-in-detection-and-classification-for-defects-in-tsv-based-3-d-ic