# ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design

> Research article (IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023) · cited 11× · AI/ML

**Wikidata**: [openalex:W4386108479](https://www.wikidata.org/wiki/openalex:W4386108479)  
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