# Integrated Thermal and Power Delivery Network Co-Simulation Framework for Single-Die and Multi-Die Assemblies

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2017) · cited 11× · AI/ML

**Wikidata**: [openalex:W2588739200](https://www.wikidata.org/wiki/openalex:W2588739200)  
**Source**: https://4ort.xyz/entity/integrated-thermal-and-power-delivery-network-co-simulation-framework-for-single-die-and-multi-die-assemblies