# In Situ Warpage Measurement of Electronic Packages With Projected Speckle DIC and Deep Learning-Based ROI Identification

> Research article (IEEE Transactions on Instrumentation and Measurement, 2024) · cited 15× · AI/ML

**Wikidata**: [openalex:W4402592847](https://www.wikidata.org/wiki/openalex:W4402592847)  
**Source**: https://4ort.xyz/entity/in-situ-warpage-measurement-of-electronic-packages-with-projected-speckle-dic-and-deep-learning-based-roi-identification