# Improved Packaging of Power Module With Low-Permittivity Material for Low Common-Mode Noise and High Reliability

> Research article (IEEE Transactions on Power Electronics, 2024) · cited 12× · AI/ML

**Wikidata**: [openalex:W4401358074](https://www.wikidata.org/wiki/openalex:W4401358074)  
**Source**: https://4ort.xyz/entity/improved-packaging-of-power-module-with-low-permittivity-material-for-low-common-mode-noise-and-high-reliability