# Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach

> Research article (2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022) · cited 13× · AI/ML

**Wikidata**: [openalex:W4320027354](https://www.wikidata.org/wiki/openalex:W4320027354)  
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