# IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2019) · cited 12× · AI/ML

**Wikidata**: [openalex:W2913605994](https://www.wikidata.org/wiki/openalex:W2913605994)  
**Source**: https://4ort.xyz/entity/ic-package-interconnect-line-characterization-based-on-frequency-variant-transmission-line-modeling-and-experimental-s-p