# Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

> Research article (IEEE Journal of the Electron Devices Society, 2019) · cited 25× · AI/ML

**Wikidata**: [openalex:W2913038296](https://www.wikidata.org/wiki/openalex:W2913038296)  
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