# HiSilicon Kirin 710

> system-on-a-chip with ARM processor cores

**Wikidata**: [Q65659341](https://www.wikidata.org/wiki/Q65659341)  
**Source**: https://4ort.xyz/entity/hisilicon-kirin-710

## Summary  
The HiSilicon Kirin 710 is a mid‑range system‑on‑a‑chip (SoC) developed by Huawei’s semiconductor arm HiSilicon. Announced on 18 July 2018, it integrates an octa‑core ARM CPU (four Cortex‑A73 and four Cortex‑A53 cores) and a Mali‑G51 GPU built on a 12 nm lithography process.

## Key Facts  
- **Announcement date:** 18 July 2018 (source: GSM Arena news).  
- **Developer:** HiSilicon, the chip‑design subsidiary of Huawei.  
- **Process technology:** 12 nm lithography (HiSilicon product list).  
- **CPU configuration:** 8 cores total – 4 × ARM Cortex‑A73 and 4 × ARM Cortex‑A53 (HiSilicon product list).  
- **GPU:** Mali‑G51 graphics processing unit (HiSilicon product list).  
- **Series:** Part of the Kirin family of SoCs.  
- **Device usage:** Powered smartphones such as Huawei Nova 3i (2018), Huawei P Smart 2019 (announced 2018), and Huawei Honor 10 Lite.  
- **Classification:** Instance of a product model; subclass of system‑on‑a‑chip, microprocessor, and graphics processing unit.  

## FAQs  
### Q: What type of processor cores does the Kirin 710 use?  
A: It combines four high‑performance ARM Cortex‑A73 cores with four energy‑efficient ARM Cortex‑A53 cores, totaling eight CPU cores.  

### Q: Which manufacturing process is used for the Kirin 710?  
A: The chip is fabricated using a 12 nm lithography process.  

### Q: In which smartphones can I find the Kirin 710?  
A: It is used in the Huawei Nova 3i, Huawei P Smart 2019, and Huawei Honor 10 Lite models.  

### Q: Who designed the Kirin 710?  
A: The SoC was designed and developed by HiSilicon, Huawei’s semiconductor division.  

### Q: What GPU does the Kirin 710 incorporate?  
A: It integrates a Mali‑G51 GPU for graphics acceleration.  

## Why It Matters  
The Kirin 710 represents Huawei’s strategic push to offer a competitive, locally designed mid‑range chipset that balances performance and power efficiency. By employing a 12 nm process, the SoC delivers respectable CPU performance with its mixed Cortex‑A73/A53 architecture while keeping thermal output and battery drain low—key concerns for everyday smartphone users. Its integration of a Mali‑G51 GPU provides adequate graphics capability for typical mobile gaming and multimedia tasks without the cost of high‑end GPUs. Deploying the Kirin 710 across multiple Huawei and Honor devices allowed the company to reduce reliance on external silicon suppliers, streamline software‑hardware integration, and differentiate its product line in a crowded market. Consequently, the chip helped Huawei maintain a strong presence in the mid‑range segment during a period of increasing geopolitical pressure on its supply chain.  

## Notable For  
- First HiSilicon mid‑range SoC built on a 12 nm process.  
- Combines a heterogeneous octa‑core CPU (Cortex‑A73 + Cortex‑A53) for balanced performance.  
- Powers several 2018‑2019 Huawei/Honor smartphones, showcasing internal ecosystem integration.  
- Part of the Kirin series, reinforcing Huawei’s brand identity in mobile chipset design.  
- Offers a Mali‑G51 GPU, delivering competent graphics for mid‑tier devices.  

## Body  

### Overview  
The Kirin 710 is a system‑on‑a‑chip (SoC) that integrates CPU, GPU, memory controller, and other essential components onto a single silicon die. It targets the mid‑range smartphone market, offering a cost‑effective alternative to flagship processors while maintaining solid performance.

### Technical Specifications  

- **CPU:**  
  - 4 × ARM Cortex‑A73 cores (high‑performance)  
  - 4 × ARM Cortex‑A53 cores (power‑efficient)  
  - Total of 8 cores  

- **GPU:**  
  - Mali‑G51 graphics processor  

- **Fabrication:**  
  - 12 nm lithography process, enabling a good power‑performance trade‑off  

- **Series Placement:**  
  - Belongs to the Kirin family, a line of SoCs developed by HiSilicon for Huawei devices.  

### Device Integration  
The Kirin 710 has been deployed in several Huawei‑branded smartphones released between 2018 and 2019:  

- **Huawei Nova 3i** – an Android smartphone launched in 2018.  
- **Huawei P Smart 2019** – announced in 2018 as a budget‑friendly model.  
- **Huawei Honor 10 Lite** – a mid‑range device within the Honor sub‑brand.  

These devices benefit from the chip’s balanced performance, enabling smooth everyday use and moderate gaming capabilities.

### Market Position  
As a mid‑range SoC, the Kirin 710 competes with Qualcomm’s Snapdragon 600‑series and MediaTek’s Helio P series. Its 12 nm process and heterogeneous core design give it an edge in power efficiency, which is especially valuable for devices targeting longer battery life at a lower price point.

### Development Context  
HiSilicon’s development of the Kirin 710 reflects Huawei’s broader strategy to internalize critical components of its smartphone ecosystem. By designing its own SoC, Huawei can tailor hardware‑software integration, optimize performance for its EMUI skin, and mitigate supply‑chain risks associated with external chip vendors.

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## References

1. [Source](http://www.hisilicon.com/en/Products/ProductList/Kirin)
2. [Source](https://www.gsmarena.com/huawei_announces_the_kirin_710_midrange_soc_based_on_the_12nm_node-news-32292.php)