# HBM3E

> type of 3D-stacked synchronous dynamic random-access memory

**Wikidata**: [Q131460391](https://www.wikidata.org/wiki/Q131460391)  
**Source**: https://4ort.xyz/entity/hbm3e

## Summary
HBM3E is a type of 3D-stacked synchronous dynamic random-access memory (SDRAM) and a subclass of High Bandwidth Memory. It is the successor to HBM3, designed to offer high-performance RAM interface capabilities. HBM3E operates with a frequency of 4900 MHz and achieves a data transfer speed of 10035 gigabits per second.

## Key Facts
- **Classification:** HBM3E is a subclass of High Bandwidth Memory (HBM), a high-performance RAM interface for 3D-stacked DRAM.
- **Succession:** It follows HBM3 in the generation of memory types.
- **Data Transfer Speed:** Offers a data transfer speed of 10035 gigabits per second (Gbit/s).
- **Frequency:** Operates at a frequency of 4900 megahertz (MHz).
- **Architecture:** Utilizes 3D-stacked synchronous dynamic random-access memory technology.
- **Aliases:** Also known as "HBM 3E" and "High Bandwidth Memory 3E."
- **Parent Standard:** Belongs to the High Bandwidth Memory class, which is associated with AMD and Hynix.

## FAQs
### Q: What is the difference between HBM3 and HBM3E?
A: HBM3E is the successor to HBM3. While both are types of 3D-stacked synchronous dynamic random-access memory, HBM3E offers updated performance specifications, specifically a data transfer speed of 10035 Gbit/s and a frequency of 4900 MHz.

### Q: What is the data transfer rate of HBM3E?
A: HBM3E has a specified data transfer speed of 10035 gigabits per second.

### Q: What does the "E" in HBM3E stand for?
A: While the raw data does not explicitly define the acronym "E," HBM3E is classified as a distinct subclass of High Bandwidth Memory that follows the HBM3 standard.

## Why It Matters
HBM3E represents a critical evolution in high-performance computing memory. As a subclass of High Bandwidth Memory—a standard pioneered by AMD and Hynix for 3D-stacked DRAM—HBM3E addresses the increasing demand for faster data processing in advanced computing environments. By pushing the frequency to 4900 MHz and data transfer speeds to over 10,000 gigabits per second, this memory type significantly reduces bottlenecks in data-heavy applications. Its development signifies the continued refinement of 3D-stacking technology, allowing for greater bandwidth and efficiency in a compact form factor compared to previous iterations like HBM3.

## Notable For
- **High Bandwidth Capacity:** Delivers a data transfer speed of 10035 Gbit/s.
- **Frequency Performance:** Operates at 4900 MHz.
- **Architectural Advancement:** Serves as the immediate successor to the HBM3 standard.
- **3D-Stacking Technology:** Utilizes vertical stacking for synchronous dynamic random-access memory.

## Body
### Classification and Lineage
HBM3E is formally classified as a type of 3D-stacked synchronous dynamic random-access memory. It falls under the broader umbrella of High Bandwidth Memory (HBM), a high-performance RAM interface originally developed for 3D-stacked DRAM. The "High Bandwidth Memory" class itself is noted for its association with AMD and Hynix.

HBM3E is the direct successor to HBM3. It shares the same fundamental definition as its predecessor—being a type of 3D-stacked synchronous dynamic random-access memory—but introduces updated performance metrics.

### Technical Specifications
The technical profile of HBM3E defines it as a high-speed memory solution.
*   **Data Transfer Speed:** The standard supports a data transfer speed of 10035 gigabits per second.
*   **Frequency:** The memory operates at a frequency of 4900 megahertz.
*   **Aliases:** The entity is also referenced as "HBM 3E" and "High Bandwidth Memory 3E."