# HBM3

> type of 3D-stacked synchronous dynamic random-access memory

**Wikidata**: [Q131460390](https://www.wikidata.org/wiki/Q131460390)  
**Source**: https://4ort.xyz/entity/hbm3

## Summary
HBM3 is a high-performance 3D-stacked dynamic random-access memory (DRAM) technology designed to deliver exceptional bandwidth for advanced computing applications. As part of the High Bandwidth Memory (HBM) class, it succeeds HBM2E and precedes HBM3E, offering improved specifications to support demanding workloads like artificial intelligence (AI) and high-performance computing (HPC).

## Key Facts
- **Type**: 3D-stacked synchronous dynamic random-access memory (DRAM).
- **Class**: Subclass of High Bandwidth Memory (HBM), developed by AMD and Hynix.
- **Predecessor**: HBM2E.
- **Successor**: HBM3E.
- **Frequency**: 3200 MHz.
- **Data Transfer Speed**: 6553.6 gigabits per second (Gbps).
- **Aliases**: HBM 3, High Bandwidth Memory 3.

## FAQs
### Q: What is HBM3 used for?
A: HBM3 is used in high-performance computing, AI, and graphics processing applications requiring ultra-high memory bandwidth.

### Q: How does HBM3 compare to HBM2E?
A: HBM3 offers higher bandwidth and improved specifications compared to HBM2E, its predecessor.

### Q: Who developed HBM3?
A: HBM3 was developed by AMD and Hynix as part of the High Bandwidth Memory (HBM) technology family.

## Why It Matters
HBM3 plays a critical role in addressing the growing demand for memory bandwidth in cutting-edge technologies like AI, supercomputing, and advanced graphics processing. By leveraging 3D-stacked architecture, HBM3 enables compact, high-capacity memory solutions with lower power consumption compared to traditional memory interfaces. This innovation helps overcome data transfer bottlenecks, allowing systems to process vast amounts of data more efficiently. As a successor to HBM2E and precursor to HBM3E, HBM3 represents a key evolutionary step in memory technology, supporting the development of next-generation computing systems.

## Notable For
- **High Bandwidth**: Delivers 6553.6 Gbps data transfer speed, enhancing performance for compute-intensive tasks.
- **3D-Stacked Design**: Enables compact, high-density memory integration.
- **Industry Collaboration**: Developed through collaboration between AMD and Hynix.
- **Scalability**: Part of a scalable HBM ecosystem supporting advancements in AI and HPC.

## Body
### Overview
HBM3 is a 3D-stacked DRAM technology designed for high-bandwidth applications. It operates at 3200 MHz and achieves data transfer speeds of 6553.6 Gbps, making it suitable for AI accelerators, GPUs, and HPC systems.

### Technical Specifications
- **Frequency**: 3200 MHz.
- **Data Transfer Speed**: 6553.6 Gbps.
- **Architecture**: 3D-stacked memory cubes with silicon interposer.

### Development and Release
- **Developers**: AMD and Hynix.
- **Predecessor**: HBM2E.
- **Successor**: HBM3E.

### Applications
- **AI/ML**: Supports training and inference workloads requiring massive parallel data processing.
- **HPC**: Enhances performance in supercomputers and scientific simulations.
- **Graphics Rendering**: Powers real-time graphics processing in gaming and professional visualization.

## Schema Markup
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  "name": "HBM3",
  "description": "Type of 3D-stacked synchronous dynamic random-access memory",
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